Peter joined ASML and the Board of Management in 1999 as Executive Vice President and CFO.
Peter has an extensive background in finance and accounting. Prior to ASML, he worked as a partner at Deloitte Accountants where he specialized in high technology with an emphasis on the semiconductor equipment industry.
ASML is an innovation leader in the semiconductor industry. We provide chipmakers with everything they need – hardware, software and services – to mass produce patterns on silicon through lithography.
Every day, our colleagues in R&D, Manufacturing, Customer Support, Sourcing and Supply Chain, and support functions take on the exciting challenge of building and maintaining the most advanced lithography systems in the world.
How we innovate
Innovation is never a straight line. But we know that even the biggest challenge can be overcome by chipping away at it, if necessary with hundreds of people over many years. We persevere.
To accelerate our product development, we engineer in parallel what might usually happen sequentially, all the while guarding our products’ reliability, manufacturability and serviceability.
We don’t innovate in isolation. In our ‘Open Innovation’ philosophy, we see ourselves as architects and integrators. This means that we develop our technology in close collaboration with our customers to ensure we build today what they need tomorrow, while we trust our supply chain to manufacture most system parts and modules. Our global network is key to our success, and we share both risk and reward. We work hard at developing long-term relationships with our partners, listening to each other and pushing each other to continuously innovate.
We innovate across our entire product portfolio at the same pace as our customers through large and sustained investment in R&D.
Our research teams collaborate with a wide network of external technology partners to create solutions that our experts can tap into when developing new systems or improving our existing models. Our partners include imec in Belgium; the Shanghai Integrated Circuit Research and Development Center in China; and the University of Twente and the Advanced Research Center for Nanolithography in the Netherlands.